A. Dupre, Theorie Mechanique de la Chaleur,(1869),369,
J. Girifalco, R.J. Good, J. Phys. Chem., 61(1957), 900.
S. K. Kang, J. Electron. Mater., 28(1999), 1314.
M. Vuorela, M. Holloway, F. Stam, J. Kivilahti, Proc. 4th International Conf. on Conductive Adhesive Joining & Coating technology in Electronics Manufacturing, IEEE, Helsinki, (2000), pp.147-152.
ISO/PRF 16525-2, Adhesives - Test methods for isotropic electrically conductive adhesives - Part 2: Determination of electrical characteristics for use in electronic assemblies.
C.P. Wong, Proc.5th SANKEN International Symposium onFrontier Material Science towards Energy Conversion and EcoDesign, Osaka, (2002).
M. Yamashita and K. Suganuma, J. Electron. Mater., 31[6](2002), 551-556.
K.Suganuma and M. Yamashita, Proc. International Symposium on Advanced Packaging Materials, Processes, Properties and Interfaces, IMAPS, Georgia, (2001), pp.23-22.
M. Komagata, G. Toida, T. Hocchi and K. Suzuki, Proc., Adhesive in Electronics 2000, IEEE, Helsinki, (2000), pp.216-220.
S.-S. Kim, K.-S. Kim, S.J. Kim, K. Suganuma, J. Electron. Mater., 38[6](2009), 896-901.
D. Lu, Q. K. Tong, C. P. Wong; IEEE Trans. Electron. Packaging Manufacturing, 22[3](1999), 223-227.
K.-S. Kim, K. Lee, K. Suganuma, S.-H. Huh; J. Microelectronics & Packaging Society, 18[3](2011), 33-37.
田中浩和;日本接着学会誌、43[7](2007)、187-194.
菅沼克昭;鉛フリーはんだ付け入門、大阪大学出版会、2013.
ISO/PRF 16525-8, Adhesives - Test methods for isotropic electrically conductive adhesives - Part 8: Electrochemical-migration test methods
D. Klosterman, L. Li, J. E. Morris;IEEE Trans. CPMT, Part, CPMT Part A, 21[1](1998), 23-31.
ISO/PRF 16525-5, Adhesives -- Test methods for isotropic electrically conductive adhesives -- Part 5: Determination of shear fatigue