P. Capper and C. T. Elliott, "Infrared Detectors and Emitters: Materials and Devices," Kluwer Academic Publishers, Norwell, MA, USA (2001).
E. L. Dereniak and D. G. Crowe, "Optical Radiation Detectors," John Wiley and Sons, New York, USA (1984).
P. W. Kruse, "Uncooled Thermal Imaging Arrays, Systems and Applications," SPIE, Bellingham, MA, USA (2001).
P. W. Kruse and D. D. Skatrud, "Uncooled Infrared Imaging Arrays and Systems," Academic Press, San Diego, CA, USA (1997).
W. Herschel, "Experiments on the refrangibility of the invisible rays of the sun," Philosophical Transactions on the Royal Society of London, Vol. 90, p. 284 (1800).
T. Ishikawa, M. Ueno, K. Endo, Y. Nakaki, H. Hata, T. Sone, M. Kimata, and T. Ozeki, "Low-cost 320×240 uncooled IRFPA using conventional silicon IC process," Proc. SPIE, Vol. 3698, pp. 556-564 (1999).
A. Rogalski, "Infrared Photon Detectors," SPIE, Bellingham, MA, USA (1995).
W. D. Lawson, S. Nielson, E. H. Putley, and A. S. Young, "Preparation and properties of HgTe and mixed crystals of HgTe-CdTe," J. Phys. Chem. Solids, Vol. 9, pp. 325-329 (1959).
P. J. Noble, "Self-scanned silicon image detector arrays," IEEE Trans. Electron Devices, Vol. ED-15, pp. 202-209 (1968).
W. S. Boyle and G. E. Smith, "Charge-coupled semiconductor devices," Bell Syst. Tech. J., Vol. 49, pp. 587-593 (1970).
M. Kimata, M. Denda, N. Yutani, S. Iwade, and N. Tsubouchi, "A 512×512 element PtSi Schottky-barrier infrared image sensor," IEEE JSSC, Vol. SC-22, pp. 1124-1129 (1987).
N. Yutani, H. Yagi, M. Kimata, J. Nakanishi, S. Nagayoshi, and N. Tsubouchi "1040×1040 element PtSi Schottkybarrier IR image sensor," Tech. Digest IEDM, San Francisco, CA, USA, pp. 175-178 (1991).
H. C. Lim, S. Tsao, M. Taguchi, W. Zhang, A. A. Quivy, and M. Razeghi, "InGaAs/InGaP quantum-dot infrared photodetectors with a high detectivity," Proc. SPIE, Vol. 6127, pp. 61270N-1-61270N-1-6 (2006).
C. Hanson, H. Beratan, and R. Owen, "Uncooled thermal imaging at Texas Instruments," Proc. SPIE, Vol. 1735, pp. 17-26 (1992).
R. A. Wood, C. J. Han, and P. W. Kruse, "Integrated uncooled infrared detector imaging array," Tech. Dig. IEEE Solid-State Sensor and Actuator Workshop, pp. 132-135 (1992).
Y. Kosasayama, T. Sugino, Y. Nakaki, Y. Fujii, H. Inoue, H. Yagi, H. Hata, M. Ueno, M. Takeda, and M. Kimata, "Pixel scaling for SOI diode uncooled infrared focal plane arrays," Proc. SPIE, Vol. 5406, pp. 504-511 (2004).
D. Murphy, M. Ray, R. Wyles, J. Asbrock, N. Lum, J. Wyles, C. Hewitt, A. Kennedy, D. V. Lue, J. Anderson, D. Bradley, R. Chin, and T. Kostzewa, "High sensitivity 25 μm microbolometer FPAs," Proc. SPIE, Vol. 4721, pp. 99-110 (2002).
C. J. Han, R. Rawlings, M. Sweeney, S. Whicker, D. Peysha, J. E. Clarke, B. Sullivan, C. Li, and P. Howard, "320×240 and 640×480 UFPAs for TWS and DVE applications," Proc. SPIE, Vol. 5783, pp. 559-565 (2005).
P. W. Norton and M. Kohin, "Technology and applications advancements of uncooled imagers," Proc. SPIE, Vol. 5783, pp. 524-530 (2005).
U. Mizrahi, A. Fraenkel, L. Bykov, A. Giladi, A. Adin, E. Ilan, N. Shiloah, E. Malkinson, Y. Zabar, D. Seter, R. Nakash, and Z. Kopolovich, "Uncooled detector development program at SCD," Proc. SPIE, Vol. 5783, pp. 551-558 (2005).
J-L. Tissot, B. Fieque, C. Trouilleau, R. Robert, A. Crasters, C. Minssian, and O. Legras, "First demonstration of 640×480 uncooled amorphous silicon IRFPA with 25 μm pixel-pitch," Proc. SPIE, Vol. 6206, pp. 620618-1-620618-14 (2006).
R. J. Blackwell, T. Bach, D. O'Donnell, J. Geneczko, and M. Joswick, "17 μm pixel 640×480 microbolometer FPA development at BAE Systems," Proc. SPIE, Vol. 6542, pp. 65421U-1-65421U-4 (2007).
C. Li, G. D. Skidmore, C. Howard, C. J. Han, L. Wood, D. Peysha, E. Williams, C. Trujillo, J. Emmett, G. Robas, D. Jardine, C-F. Wan, and E. Clarke, "Recent development of ultra-small pixel uncooled focal plane arrays at DRS," Proc. SPIE, Vol. 6542, pp. 65421Y-1-65421Y-12 (2007).
24) D. Murphy, M. Ray, J. Wyles, C. Hewitt, R. Wyles, E. Gordon, K. Almada, T. Sessler, S. Baur, D. Van Lue, and S. Black, "640×512 17 μm microbolometer FPA and sensor development," Proc. SPIE, Vol. 6542, pp. 65421Z-1-65421Z-10 (2007).
T. Endoh, S. Tohyama, T. Yamazaki, Y. Tanaka, K. Okuyama, S. Kurashina, M. Miyoshi, K. Katoh, T. Yamamoto, Y. Okuda, T. Sasaki, H. Ishizaki, T. Nakajima, K. Shinoda, and T. Tsuchiya, "Uncooled infrared detector with 12μm pixel pitch video graphics array," Proc. SPIE, Vol. 8704, pp. 87041G-1-87041G-11 (2013).
A. Kennedy, P. Masini, M. Lamb, J. Hamers, T. Kocian, E. Gordon, W. Parrish, R. Williams, and T. LeBeau, "Advanced uncooled sensor product development," Proc. SPIE, Vol. 9451, pp. 94511C-1-94511C-10 (2015).
K-M. Muckensturm, D. Weiler, F. Hochschulz, C. Busch, T. Geruschke, S. Wall, J. He, D. Wu-rfel, R. Lerch, and H. Vogt, "Measurement results of a 12 μm pixel size microbolometer array based on a novel thermally isolating structure using a 17 μm ROIC," Proc. SPIE, Vol. 9819, pp. 98191N-1-98191N9 (2016).
G. D. Skidmore, "Uncooled 10 μm FPA development at DRS," Proc. SPIE, Vol. 9819, pp. 98191O-1-98191O-9 (2016).
D. Fujisawa, T. Maekawa, Y. Ohta, Y. Kosasayama, T. Ohnakado, H. Hata, M. Ueno, H. Ohji, R. Sato, H. Katayama, T. Imai, and M. Ueno, "2-million-pixel SOI diode uncooled IRFPA with 15 μm pixel pitch," Proc. SPIE, Vol. 8352, pp. 83531G-1- 83531G -13 (2012).
D. Murphy, M. Ray, A. Kennedy, J. Wyles, C. Hewit, R. Wyles, E. Gordon, T. Sessler, S. Baur, D. V. Lue, S. Anderson, R. Chin, H. Gonzalez, C. L. Pere, S. Ton, and T. Kostrzewa, "Expand applications for high performance VOx microbolometer FPAs," Proc. SPIE, Vol. 5783, pp. 448-559 (2005).
C. Trouillwau, B. Fieque, S. Noblet, F. Giner, D. Pochic, A. Durand, P. Robert, S. Cortial, M. Vilain, J. L. Tissot, and J. J. Yon, "High-performance uncooled amorphous silicon TEC less XGA IRFPA with 17 μm pixel-pitch," Proc. SPIE, Vo. 7298, pp. 72980Q-1-72980Q-6 (2009).
S. H. Black, T. Sessler, E. Gordon, R. Kraft, T Kocian, M. Lamb, R. Williams, and T. Yang, "Uncooled detector development at Raytheon," Proc. SPIE, Vol. 8012, pp. 80121A-1-80121A-12 (2011).
鈴木久之, "World's first commercial thermal sensor with 12μm pixel," 赤外線アレイセンサーフォーラム、立命館大学 (2015).
M. Ueno, Y. Kosasayama, T. Sugino, Y. Nakaki, Y. Fujii, H. Inoue, K. Kama, T. Seto, M. Takeda, and M. Kimata, "640×480 pixel IR imaging uncooled infrared FPA with SOI diode detectors," Proc. SPIE, Vol. 5783, pp. 567-577 (2005).
P. I. Oden, E. A. Wachter, P. G. Datskos, T. Thundat, and R. J. Warmack, "Optical and infrared detection using microcantilevers," Proc. SPIE, Vol. 2744, pp. 345-354 (1996).
A. Flusberg and D. Deliwala, "Highly sensitive infrared imager with direct optical readout," Proc. SPIE, Vol. 6206, pp. 62061E-1- 62061E1-8 (2006).
R. D. Hudson, "Infrared System Engineering," John Wiley and Sons, Inc., Hoboken, NJ, USA (2006).
J. M. Lloyd, "Thermal Imaging Systems," Plenum Press, New York, USA (1975).
R. A. Wood, "Uncooled thermal imaging with monolithic silicon focal planes," Proc. SPIE, Vol. 2020, pp. 322-329 (1993).
56) 株式会社アルバック編、新版真空ハンドブック (CD-ROM版)、オーム社 (2002).
K. C. Liddiard, "Application of interferometric enhancement to self-absorbing thin film thermal IR detectors," Infrared Phys., Vol. 34, pp. 379-384 (1993).
M. Hirota and S. Morita, "Infrared sensor with precisely patterned Au-black absorption layer," Proc. SPIE, Vol. 3436, pp. 623-635 (1998).
E. J. Wollack, R. E. Kinzer, and S. A. Rinehart, "A cryogenic infrared calibration target," Review of Scientific Instruments, Vol. 85, pp. 044707-1-044707-5 (2014).
R. Lenggenhanger, H. Baltes, J. Peer, and M. Forster, "Thermoelectric infrared sensors by CMOS technology," IEEE Electron. Device Lett., Vol. 13, pp. 454-456 (1992).
R. Lenggenhager, H. Baltes, and T. Elbel, "Thermoelectric infrared sensors in CMOS technology," Sensors and Actuators A, Vol. 37-38, pp. 216-220 (1993).
A. S. Weling and P. F. Henning, "Antenna-coupled microbolometers for multi-spectral infrared imaging," Proc. SPIE, Vol. 6206, pp. 62061F-1-62061F-8 (2006).
J-Y. Jung, J. Y. Park, and D. P. Neikirk, "Wavelength-selective infrared detectors based on cross patterned resistive sheet," Proc. SPIE, Vol. 7298, pp. 72980L-1-72980L-6 (2009).
S. Ogawa, J. Komoda, K. Masuda, and M. Kimata, "Wavelength selective wideband uncooled infrared sensor using a two-dimensional plasmonic absorber," Optical Engineering, Vol. 52, pp. 127104-1-127104-5 (2013).
S. Ogawa, K. Okada, N. Fukushima, and M. Kimata, "Wavelength selective uncooled infrared sensor by plasmonics," Applied Physics Letters, Vol. 100, pp. 021111-1-021111-4 (2012).
R. Fiete, "Image quality and λFN/p for remote sensing systems," Opt. Eng., Vol. 38, pp. 1229-1240 (1999).
H. Beratan, C. Hanson, and E. G. Meissner, "Low-cost uncooled ferroelectric detector," Proc. SPIE, Vol. 2274, pp. 147-156 (1994).
C. Hanson, "Uncooled thermal imaging at Texas Instruments," Proc. SPIE, Vol. 2020, pp. 330-339 (1993).
R. Owen, S. Frank, and C. Daz, "Producibility of uncooled IRFPA detectors," Proc. SPIE, Vol. 1683, pp. 74-80 (1992).
R. Watton, P. A. Manning, M. J. C. Perkins, J. P. Gillham, and M. A. Todd, "Uncooled IR imaging: Hybrid and integrated bolometer arrays," Proc. SPIE, Vol. 2744, pp. 486-499 (1996).
R. K. McEwen and P. A. Manning, "European uncooled thermal imaging sensors," Proc. SPIE, Vol. 3698, pp. 322-337 (1999).
R. Watton and P. Manning, "Ferroelectrics in uncooled thermal imaging," Proc. SPIE, Vol. 3436, pp. 541-554 (1998).
J. F. Belcher, C. M. Hanson, H. R. Beratan, K. R. Udayakumar, and K. L. Soch, "Uncooled monolithic ferroelectric IRFPA technology," Proc. SPIE, Vol. 3436, pp. 611-622 (1998).
C. M. Hanson and H. R. Beratan, "Thin-film ferroelectrics: Breakthrough," Proc. SPIE, Vol. 4721, pp. 91-99 (2002).
C. M. Hanson, H. R. Beratan, and J. F. Belcher, "Uncooled infrared imaging using thin-film ferroelectrics," Proc. SPIE, Vol. 4288, pp. 298-303 (2001).
M. A. Todd, P. A. Manning, P. P. Donohue, A. G. Brown, and R. Watton, "Thin film ferroelectric materials for microbolometer arrays," Proc. SPIE, Vol. 4130, pp. 128-139 (2001).
H. Xu, T. Mukaigawa, K. Hashimoto, R. Kubo, T. Kiyomoto, H. Zhu, M. Noda, and M. Okuyama, "Si monolithic microbolometers of ferroelectric BST thin film combined with readout FET for uncooled infrared image sensor," Tech Dig. 10th Int. Conf.Solid-State Sensors and Actuators (Transducers), pp. 398-401 (1999).
H. Xu, K. Hashimoto, T. Mukaigawa, H. Zhu, R. Kubo, T. Usuki, H. Kishihara, M. Noda, Y. Suzuki, and M. Okuyama, "Development of Si monolithic (Ba,Sr) TiO3 thin-film ferroelectric microbolometers for uncooled chopperless infrared sensing," Proc. SPIE 4130, pp. 140-51 (2000).
N. Fujitsuka, J. Sakata, Y. Miyachi, K. Mizuno, K. Ohtsuka, Y. Taga, and O. Tabata, "Monolithic pyroelectric infrared image sensor using PVDF thin film," Proc. Int. Conf. Solid-State Sensors and Actuators (Transducers), pp. 1237-1240 (1997).
P. W. Kruse, L. D. McGlauchlin, and R. B. McQuistan, "Elements of Infrared Technology: Generation, Transmission, and Detection," John Wiley and Sons, New York, USA (1962).
K. C. Liddiard, "Thin-film resistance bolometer IR detectors," Infrared Phys., Vol. 24, pp. 57-64 (1983).
R. A. Wood, "High-performance infrared thermal imaging with monolithic silicon focal planes operating at room temperature," Proc. IEEE IEDM, pp. 175-177 (1993).
R. Herring and P. E. Howard, "Design and performance of the ULTRA 320×240 uncooled focal plane array and sensor," Proc. SPIE, Vol. 2746, pp. 2-12 (1996).
P. E. Howard and J. E. Clarke, "Advanced high-performance 320×240 VOx microbolometer uncooled IR focal plane," Proc. SPIE, Vol. 3698, pp. 131-137 (1999).
C. Marshall, N. Butler, R. Blackwell, R. Murphy, and T. Breen, "Uncooled infrared sensor with digital focal plane array," Proc. SPIE, Vol. 2746, pp. 23-31 (1996).
W. Radford, D. Murphy, M. Ray, S. Propst, A. Kennedy, J. Kojiro, J. Woolaway, K. Soch, R. Coda, G. Lung, E. Moody, D. Gleichman, and S. Baur, "320×240 silicon microbolometer uncooled IRFPAs with on-chip offset correction," Proc. SPIE, Vol. 2746, pp. 82-92 (1996).
B. Terre, B. Cannata, P. Franklin, A. Gonzalez, E. Kurth, H. Ly, B. Parrish, K. Peters, T. Romeo, and B. VanYsseldyk, "Microbolometer development and production at Indigo Systems," Proc. SPIE, Vol. 5074, pp. 518-526 (2003).
H. Wada, M. Nagashima, N. Oda, T. Sasaki, A. Kawahara, M. Kanzaki, Y. Tsuruta, T. Mori, S. Matsumoto, T. Sima, M. Hijikawa, N. Tsukamoto, and H. Gotoh, "Design and performance of 256×256 bolometer-type uncooled infrared detector," Proc. SPIE, Vol. 3379, pp. 90-100 (1998).
J. Brady, T. Schimert, D. Ratcliff, R. Gooch, B. Ritchey, P. McCardel, K. Rachels, S. Ropson, M. Wand, W. Weinstein, and J. Wynn, "Advances in amorphous silicon uncooled IR systems," Proc. SPIE, Vol. 3698, pp. 161-167 (1999).
G. L. Francisco, "Amorphous silicon bolometer for fire/rescue," Proc. SPIE, Vol. 4360, pp. 138-148 (2001).
E. Mottin, A. Bain, J. L. Martin, J. L. Ouvrier-Buffet, J. J. Yon, J. P. Chatard, and Tissot, "Uncooled amorphous silicon technology: High performance achievement and feature trends," Proc. SPIE, Vol. 4721, pp. 56-63 (2002).
J-L. Tissot, F. Rothan, C. Vedel, M. Vilain, and J-J.Yon, "LETI/LIR's amorphous silicon uncooled microbolometer development," Proc. SPIE, Vol. 3436, pp. 139-144 (1998).
J-L. Tissot, J-J. Martin, E. Mottin, M. Viain, J-J. Yon, and J. P. Chatard, "320×240 microbolometer uncooled IRFPA development," Proc. SPIE, Vol. 4130, pp. 473-479 (2000).
M. H. Unewiss, B. I. Craig, R. J. Watson, O. Reinholed, and K. C. Liddiard, "The growth and properties of semiconductor bolometers for infrared detection," Proc. SPIE, Vol. 2554, pp. 43-54 (1995).
C. Vedel, J-L. Martin, J. L. Ouvrier-Buffet, J-L. Tissot, M. Vilain, and J-J. Yon, "Amorphous silicon based uncooled microbolometer IRFPA," Proc SPIE, Vol. 3698, pp. 276-283 (1999).
S. Eminogl, D. S. Tezcan, and T. Akin, "A CMOS n-well microbolometer FPA with temperature coefficient enhancement circuitry," Proc. SPIE, Vol. 4369, pp. 240-249 (2001).
D. S. Tezcan, S. Eminoglu, O. S. Akae, and T. Akin, "An uncooled microbolometer infrared focal plane array in standard CMOS," Proc. SPIE, Vol. 4288, pp. 112-121 (2001).
M. Henini and M. Razeghi, "Handbook of Infrared Detection Technologies," Elsevier Science Ltd, Oxford, UK (2002).
V. N. Leonov, Y. Greten, P. D. Moor, B. D. Bois, C. Goessens, B. Grietens, P. Merken, N. A. Perova, G. Puttens, C. V. Hoof, A. Verbist, and J. Veermeiren, "Small two-dimensional and linear arrays of polycrystalline SiGe microbolometers at IMEC-Xenics," Proc. SPIE, Vol. 5074, pp. 446-457 (2003).
D. P. Moor, J. John, S. Sedky, and C. V. Hoof, "Linear arrays of fast uncooled poly SiGe microbolometers for IR detection," Proc. SPIE, Vol. 4028, pp. 27-34 (2000).
S. Sedky, P. Fiorini, M. Caymax, C. Baert, L. Hermans, and R. Mertens, "Characterization of bolometers based on polycrystalline silicon germanium alloys," IEEE Eelctron Device Lett., Vol. 19, pp. 376-378 (1998).
M. Rana and D. P. Butler, "Amorphous GexSi1-x and GexSi1-xOy thin films for uncooled microbolometers," Proc. SPIE, Vol. 5783, pp. 597-606 (2005).
M. L. Hai, M. Hesan, J. Lin, Q. Cheng, M. Jalal, A. J. Syllaios, S. Ajmera, and M. Almasri, "Uncooled silicon germanium oxide (SixGeyO1-x-y) thin films for infrared detection," Proc. SPIE, Vol. 8353, pp. 835317-1-835317-14 (2012).
P. Ericsson, A. C, Fischer, F. Forsberg, N. Roxhed, B. Samel, S. Savage, G. Stemme, S. Wissmar, O. Oberg, and F. Niklaus, "Towards 17 μm pitch heterogeneously integrated Si/SiGe quantum well bolometer focal plane arrays," Proc. SPIE, Vol. 8012, pp. 801216-1-801216-10 (2011).
A. Rober, A. Lapadatu, E. Wolla, and G. Kittisland, "High performance LWIR microbolomerter with Si/SiGe quantum well thermistor and wafer level package," Proc. SPIE, Vol. 8704, pp. 87041B-1-87041B-9 (2013).
M. Almasri, D. P. Butler, and Z. Celik-Butler, "Semiconducting YBCO bolometers for uncooled IR detection," Proc. SPIE, Vol. 4028, pp. 17-26 (2000).
A. Jahanzeb, C. M. Traverse, Z. Celik-Butler, D. P. Butler, and S. G. Tan, "A semiconductor YBaCuO microbolometer for room temperature IR imaging," IEEE Trans. Electron Devices, Vol. 44, pp. 1795-1801 (1997).
Z. Celik-Butler, D. P. Butler, and A. Yildiz, "Room-temperature YBaCuO infrared detectors on a flexible substrate," Proc. SPIE, Vol. 4721, pp. 260-268 (2002).
H. Wada, T. Sone, H. Hata, Y. Nakaki, O. Kaneda, Y. Ohta, M. Ueno, and M. Kimata, "YBaCuO uncooled microbolometer IRFPA," Sensors and Materials., Vol. 12, pp. 315-325 (2000).
P. A. Manning, J. P. Gillha, N. J. Parkinson, and T. P. Kaushal, "Silicon foundry micro-bolometers - The route to the mass market thermal imager," Proc. SPIE, Vol. 5406, pp. 465-472 (2004).
A. Tanaka, S. Natsumoto, B. Tsukamoto, S. Itoh, K. Chiba, T. Endoh, A. Nakazato, K. Okuyama, Y. Kumazawa, M. Hijikawa, H. Gotoh, T. Tanaka, and N. Teranishi, "Infrared focal plane array incorporating silicon IC process compatible bolometer," IEEE Trans. Electron Devices, Vol. 43, pp. 1844-1850 (1996).
Y. S. Lee, D. S. Kim, Y-C. Jung, and H. C. Lee, "Electric characteristic of nickel oxide film for microbolometer," Proc. SPIE, Vol. 8012, pp. 80121P-1-80121P-7 (2011).
Y. Jim, D. S. John, T. N. Jackson, and M. W. Horn, "Nickel oxide and molybdenum oxide thin films for infrared imaging prepared by biased target ion-beam deposition," Proc. SPIE, Vol. 9070, pp. 90701S-1-90701S-8 (2014).
Y. Jeong, M-H. Kwon, S.G. Kang, and H. Jung, "Development of titanium oxide based 12μm pixel pitch uncooled infrared detector," to be published in Proc. SPIE, Vol. 10624 (2018).
T. Endoh, S. Tohyama. T. Yamazaki, Y. Tanaka, K. Okuyama, S. Kurashima, M. Miyoshi, K. Katoh, T. Yamamoto, Y. Okuda, and T. Sasaki, "Uncooled infrared detector with 12 μm pixel pitch video graphic array," Proc. SPIE, Vol. 8704, pp. 87031G-1-8704G-10 (2013).
W. Radford, D. Murphy, A. Finch, K. Hay, A. Kennedy, M. Ray, A. Sayed, J. Wyles, J. Varesi, E. Moody, and F. Cheung, "Sensitivity improvements in uncooled microbolometer FPAs," Proc. SPIE, Vol. 3698, pp. 119-130 (1999).
D. Murphy, A. Kennedy, M. Ray, J. Wyles, J. Asbrock, C. Hewitt, D. V. Lue, T. Sessler, J. Anderson, D. Bradley, R. Chin, H. Gonzalez, C. L. Pere, and T. Kostrzewa, "Resolution and sensitivity improvements for VOx microbolometer FPAs," Proc. SPIE, Vol. 5074, pp. 402-413 (2003).
D. Murphy, M. Ray, A. Kennedy, J. Wyles, C. Hewitt, E. Gordon, T. Sessler, S. Baur, D. V. Lue, S. Anderson, R. Chin, H. Gonzalez, C. L. Pere, and S. Ton, "High sensitivity 640×512 (20 μm pitch) microbolometer FPAs," Proc. SPIE, Vol. 6206, pp. 62061A-1-1-62061A-14 (2006).
H. Jerominek, T. D. Pope, C. Alain, A. Zhang, F. Picard, M. Lehoux, F. Cayer, S. Savard, C. Larouche, and C. Crenier, "Miniature VO2-based bolometric detectors for high-performance uncooled FPAs," Proc. SPIE, Vol. 4028, pp. 47-56 (2000).
H-K. Lee, J-B. Yoon, E. Yoon, S-B. Ju, Y-J. Yong, W. Lee, and S-G. Kim, "A high fill-factor IR bolometer using multi-level electrothermal structures," Tech. Dig. IEEE Int. Electron Device Meeting, pp. 463-466 (1998).
S. Tohyama, M. Miyoshi, S. Kurashina, N. Ito, T. Sasaki, A. Ajisawa, and N. Oda, "New thermal isolation pixel structure for high-resolution uncooled infrared FPAs," Proc. SPIE, Vol. 5406, pp. 428-436 (2004).
K. A. Hay and D. V. Deusen, "Uncooled focal plane array detector development at Infrared Vision Technology Corporation," Proc. SPIE, Vol. 5783, pp. 514-523 (2005).
K-M. Muckensturm, D. Weiler, F. Hochschulz, C. Busch, T. Geruschke, S. Wall, J. Heb, D. Wufel, R. Lerch, and H. Vogt, "Measurement results of a 12μm pixel size microbolometer array based on a novel thermally isolating structure using 17μm ROIC," Proc. SPIE, Vol. 98191N-1-98191N-9 (2016).
M. Altman, B. Backer, M. Kohin, R. Blackwell, N. Butler, and J. Cullen, "Lockheed Martin's 640×480 uncooled microbolometer camera," Proc. SPIE, Vol. 3698, pp. 137-143 (1999).
P. W. Norton, S. Cox, B. Murphy, K. Grealish, M. Joswick, B. Denley, F. Feda, L. Elmali, and M. Kohin, "Uncooled thermal imaging sensor and application advances," Proc. SPIE, Vol. 6206, pp. 620617-1-620617-7 (2006).
E. Mottin, J-L. Martin, J-L. Ouvrrier-buffet, M. Vilain, A. Bain, J-J. Yon, J-L. Tissot, and J-P. Chatard, "Enhanced amorphous silicon technology for 320×240 microbolometer arrays with a pitch of 35 μm," Proc. SPIE, Vol. 4369, pp. 250-256 (2001).
J-J. Yon, A. Astier, S. Bisotto, G. Chamings, A. Durand, J. L. Martin, E. Mottin, J. L. Ouvrier-Buffet, and J-L. Tissot, "First demonstration of 25 μm pitch uncooled amorphous silicon microbolometer IRFPA at LETI-LIR," Proc. SPIE, Vol. 5783, pp. 432-40 (2005).
D. Weiler, F. Hochschulz, D. Wurfel, R. Lerch, T. Geruschke, S. Wall, J, Heb, Q. Wang, and H. Vogt, "Uncooled digital IRFPA-family with 17μm pixel-pitch based on amorphous silicon with massively parallel sigma-delta-ADC readout," Proc. SPIE, Vol. 9070, pp. 90701M-1-90701M-6 (2014).
C. Li, C. J. Han, G. D. Skidmore, G. Cook, K. Kubala, R. Bates, D. Temple, J. Lannon, A. Hilton, K. Glukh, and B. Hardy, "Low cost uncooled VOx infrared camera development," Proc. SPIE, Vol. 8704, pp. 87041L-1-87041L-10 (2013).
C. Li, G. D. Skidmore and C. J. Han, "Uncooled VOx Infrared Sensor Development and Application," Proc. SPIE, Vol. 8012, pp. 80121N-1-80121N-8 (2011).
A. Durand, J. L. Tissot, P. Robert, S. Cortial, C. Roman, M. Vilain, and O. Legras, "VGA 17 μm development for compact, low power systems," Proc. SPIE, Vol. 8012, pp. 80121C-1-80121C-7 (2011).
U. Mizrahi, N. Argaman, S. Elkind, A. Giladi, Y. Hirsh, M. Labilov, I. Pivnik, N. Shiloah, M. Singer, A. Tuito, M. Ben-Ezra, and I. Shitrichman, "Large format 17μm high-end VOx --Bolometer infrared detector," Proc. SPIE, Vol. 8704, pp. 87041H-1-87041H-8 (2013).
J. Lee, C. Rodriguez, and R. Blackwell, "BAE Systems' 17μm LWIR camera core for civil, commercial and military applications," Proc. SPIE, Vol. 8704, pp. 87041J-1-87041J-6 (2013).
U. Mizrahi, S. Yuval, Y. Hirsh, Y. Sinai, Y. Lury, Y. Gridish, N. Syrel, Y. Shamay, R. Meshorer, R. Iosevich, and S. L. Horesh, "Low-SWaP shutterless uncooled video core by SCD," Proc. SPIE, Vol. 9451, pp. 94511E-1-94511E-9 (2015).
A. Kennedy, P. Masini, M. Lamb, J. Hamers, T. Kocian, E. Gordon, W. Parrish, R. Williams, and T. LeBeau, "Advanced uncooled sensor product development," Proc. SPIE, Vol. 9451, pp. 94511C-1-94511C-10 (2015).
L. Sengupta, P-A. Auroux, D. McManus, D. A. Harris, R. J. Blackwell, J. Bryant, M. Boal, and E. Binkerd, "BAE Systems' SMART chip camera FPA development," Proc. SPIE, Vol. 9451, pp. 94511B-1-94511B-7 (2015).
J-L. Tissot, A. Crastes, C. Trouilleau, B. Fieque, and S. Tinnes, "Multipurpose high performance 160×120 uncooled IRFPA," Proc. SPIE, Vol. 5406, pp. 550-556 (2004).
G. R. Lahiji and K. D. Wise, "A batch-fabricated silicon thermopile infrared detector," IEEE Trans. Electron. Devices, Vol. ED-29, pp. 14-22 (1982).
I. H. Choi and K. D. Wise, "A silicon-thermopile-based infrared sensing array for use in automated manufacturing," IEEE Trans. Electron Devices, Vol. ED-32, pp. 72-79 (1986).
R. Lenggenhager, H. Baltes, and T. Elbel, "Thermoelectric infrared sensors in CMOS technology," Sensors and Actuators A, Vol. 37-38, pp. 216-220 (1993).
A. D. Oliver and K. D. Wise, "A 1024-element bulk-micromachined thermopile infrared imaging array," Sensors and Actuators, Vol. 73, pp. 222-231 (1999).
N. Schneeberger, O. Paul, and H. Baltes, "Optimization structured absorbers for CMOS infrared detectors," Proc. Transducers '95 and Eurosensors IX, pp. 25-29 (1995).
U. Munch, D. Jaeggi, N. Schneeberger, A. Schaufelberbuhl, O. Paul, H. Baltes, and J. Jasper, "Industrial fabrication technology for CMOS infrared sensor arrays," Proc. Transducers '97, pp. 205-208 (1997).
A. Schaufelbuhl, N. Scheeberger, U. Munch, M. Waelti, O. Paul, O. Brand, H. Baltes, C. Menolfi, Q. Huang, E. Doering, and M. Loepfe, "Uncooled low-cost thermal imager based on micromachined CMOS integrated sensor array," IEEE J. MEMS, Vol. 10, pp. 503-510 (2001).
M. Hirota, F. Satou, M. Saito, Y. Kishi, Y. Nakajima, and M. Uchiyama, "Thermoelectric infrared imager and automotive applications," Proc. SPIE, Vol. 4369, pp. 312-321 (2001).
M. Hirota, Y. Nakajima, M. Saito, F. Satou, and M. Uchiyama, "120×90 element thermopile array fabricated with CMOS technology," Proc. SPIE, Vol. 4820, pp. 239-249 (2003).
T. Kanno, M. Saga, S. Matsumoto, M. Uchida, N. Tsukamoto, A. Tanaka, S. Itoh, A. Nakazato, T. Endoh, S. Tohyama, Y. Yamamoto, S. Murashima, N. Fujimoto, and N. Teranishi, "Uncooled infrared focal plane array having 128×128 thermopile detector elements," Proc. SPIE, Vol. 2269, pp. 450-459 (1994).
M. C. Foote and E. W. Jones, "High performance micromachined thermopile linear arrays," Proc. SPIE, Vol. 3379, pp. 192-197 (1998).
M. C. Foote, E. W. Jones, and T. Caillat, "Uncooled thermopile infrared detector linear arrays with detectivity greater than 109 cmHz1/2/W," IEEE Trans. Electron Devices, Vol. 45, pp. 1896-1902 (1998).
M. C. Foote and S. Gaalema, "Progress towards high performance thermopile imaging arrays," Proc. SPIE, Vol. 4369, pp. 350-355 (2001).
A. Dehe, K. Fricke, and H. L. Hartnagel, "Infrared thermopile sensor based on AlGaAs-GaAs micromachining," Sensors and Actuators A, Vol. 46-47, pp. 432-436 (1995).
A. Dehe, D. Pavlidis, K. Hong, and H. L. Hartnagel, "InGaAs/InP thermoelectric infrared sensor utilizing surface bulk micromachining technology," IEEE Trans. Electron Devices, Vol. 44, pp. 1052-1059 (1997).
S. M. Sze, "Physics of Semiconductor Devices," John Wiley and Sons, New York (1969).
M. Suzuki, K. Makino, A. Tanaka, R. Asahi, O. Tabata, S. Sugiyama, and M. Takigawa, "An infrared detector using poly-silicon p-n junction diode," Tech. Dig. 9th Sensor Symposium, pp. 71-74 (1990).
A. Tanaka, M. Suzuki, R. Asahi, O. Tabata, and S. Sugiyama, "Infrared linear image sensor using a poly-Si pn junction diode array," Infrared Phys., Vol. 33, pp. 229-236 (1992).
R. Asahi, O. Tabata, F. Suzuki, S. Sugiyama, M. Suzuki, and A. Tanaka, "An infrared imaging sensor using poly-silicon p-n junction diodes," Tech. Dig. 11th Sensor Symposium, pp. 99-102 (1992).
M. Kimata, M. Ueno, M. Takeda, and T. Seto, "SOI diode uncooled infrared focal plane arrays," Proc. SPIE, Vol. 6127, pp. 61270X-1-61270X-11 (2006).
T. Ishikawa, M. Ueno, Y. Nakaki, K. Endo, Y. Ohta, J. Nakanishi, K. Kosasayama, H. Yagi, T. Sone, and M. Kimata, "Performance of 320×240 uncooled IRFPA with SOI diode detectors," Proc. SPIE, Vol. 4130, pp. 152-159 (2000).
Y. Nakaki, H. Hata, H. Yagi, H. Inoue, T. Sugino, M. Ueno, M. Takeda, and M. Kimata, "Dry micromachining process for uncooled IR FPA with SOI diode detectors," Proc. SENSOR 2003, pp. 179-184 (2003).
D. Takamuro, T. Maegawa, T. Sugino, Y. Kosasayama, T. Ohnakado, H. Hata, M. Ueno, H. Fukumoto, and K. Ishida, "Development of new SOI diode structure for beyond 17μm pixel pitch SOI diode uncooled IRFPAs," Proc. SPIE, Vol. 8012, pp. 80121E-1-80121E-10 (2011).
小笹山、杉野、中木、上野、釜、"高感度SOIダイオード方式非冷却赤外線FPA"、映像情報メディア学会技術報告、Vol. 32, pp. 21-26 (2008).
S. Eminoglu, M. Y. Tanrikulu, D. S. Tezcan, and T. Akin, "A low-cost small pixel uncooled infrared detector for large focal plane arrays using a standard CMOS process," Proc. SPIE, Vol. 4721, pp. 111-121 (2002).
S. Eminoglu, M. Y. Tanrikulu, and T. Akin, "Low-cost uncooled infrared detector arrays in standard CMOS," Proc. SPIE, Vol. 5074, pp. 425-436 (2003).
J. E. Murguia, P. K. Tedrow, F. D. Shepherd, D. Leahy, and M. M. Weeks, "Performance analysis of a thermoionic thermal detector at 400 K, 300 K, and 200 K," Proc. SPIE, Vol. 3698, pp. 361-375 (1999).
R. Amantea, C. M. Knoedler, F. P. Pantuso, V. K. Patel, D. J. Sauer, and J. R. Tower, "An uncooled IR imager with 5mK NETD," Proc. SPIE, Vol. 3061, pp. 210-222 (1997).
W. Wang, V. Ypadhyay, C. Munoz, J. Bumgarner, and O. Edwards, "FEA simulation, design and fabrication of uncooled MEMS capacitive thermal detector for infrared FPA imaging," Proc. SPIE, Vol. 6206, pp. 62061L-1-62061L-12 (2006).
S. R. Hunter, R. A. Amante, L. A. Goodman, D. B. Kharas, S. Gershtein, J. R. Matey, S. N. Perna, Y. Yu, N. Maley, and L. K. White, "High sensitivity uncooled microcantilever infrared imaging arrays," Proc. SPIE, Vol. 5074, pp. 469-480 (2003).
R. Amantea, L. A. Goodman, F. Pantuso, D. J. Sauer, M. Varghese, T. S. Villani, and L. K. White, "Progress towards an uncooled IR imager with 5 mK NETD," Proc. SPIE, Vol. 3436, pp. 647-659 (1998).
S. R. Hunter, G. S. Mauer, G. Simelgor, and J. Jiang, "High sensitivity uncooled microcantilever infrared imaging arrays," Proc. SPIE, Vol. 6206, pp. 62061J-1-1-62061J-12, USA (2006).
P. G. Datskos, S. Rajic, L. R. Senesac, D. D. Earl, B. M. Evans, J. L. Corbeil, and I. Datskou, "Optical readout of uncooled thermal detectors," Proc. SPIE, Vol. 4230, pp. 185-197 (2000).
T. Ishizuya, J. Suzuki, K. Akagawa, and T. Kazama, "Optically readable bi-materials infrared detector," Proc. SPIE, Vol. 4369, pp. 342-349 (2001).
Y. Zhao, J. Choi, R. Horowtz, A. Majumdar, J. Kitching, and P. Norton, "Characterization and performance of optomechanical uncooled infrared imaging system," Proc SPIE, Vol. 4820, pp. 164-174 (2003).
M. Wu, J. Cook, R. D. Vito, J. Li, E. Ma, R. Murano, N. Nemchuk, M. Tabasky, and M. Wagner, "Novel low-cost uncooled infrared camera," Proc. SPIE, Vol. 5783, pp. 496-505 (2005).
L. Secundo, Y. Lubianiker, and A. J. Agranat, "Uncooled FPA with optical reading: Reaching the theoretical limit," Proc. SPIE, Vol. 5783, pp. 483-495 (2005).
B. E. Cole, R. E. Higashi, J. A. Ridely, and R. A. Wood, "Integrated vacuum packaging for low-cost light-weight uncooled microbolometer arrays," Proc. SPIE, Vol. 4369, pp. 235-239 (2001).
H. Hata, Y. Nakaki, H. Inoue, Y. Kosasayama, Y. Ohta, H. Fukumoto, T. Seto, K. Kama, M. Takeda, and M. Kimata, "Uncooled IRFPA with chip scale vacuum package," Proc. SPIE, Vol. 6206, pp. 620612-1-620619-10 (2006).
T. Ito, T. Tokuda, M. Kimata, H. Abe, and N. Tokashiki, "Vacuum packaging technology for mass production of uncooled IRFPAs," Proc. SPIE, Vol. Vol. 7298, pp. 72982A-1-72982A-10 (2009).
M. Kimata, T. Tokuda, A. Tsuchinaga, T. Matsumura, H. Abe, and N. Tokashiki, "Vacuum packaging technology for uncooled infrared sensor," IEEJ Transactions on Electrical and Electronic Engineering, Vol. 5, pp. 175-180 (2010).
A. Astier, A. Arnaud, J-L. Ouvrier-Buffet, J-J. Yon, and E. Motin, "Advanced packaging developed for very low cost uncooled IRFPA," Proc. SPIE, Vol. 5406, pp. 412-421 (2004).
G. Dumont, A. Arnaud, P. Imperinetti, C. Vialle, W. Rabaud, V. Goudon, and J-J. Yon, "Innovative on-chip packaging applied to uncooled IRFPA," Proc. SPIE, Vol. 6940, pp. 69401Y-1-69401Y-6 (2008).
J. J. Yon, G. Dumont, V. Goudon, S. Becker, and A. Arnaud, "Latest improvements in microbolometer thin film packaging: Paving the way for low cost consumer applications," Proc. SPIE, Vol. 9070, pp. 90701N-1-90701N-8 (2014).